tapebrief

SNPS · Q2 2025 Earnings

Bullish

Synopsys

Reported May 28, 2025

30-second summary

Synopsys delivered $1.604B in Q2 revenue (+10.3% YoY), with Design IP up 20.5% offsetting a softer 6.4% in Design Automation and an acknowledged China decline. Management reaffirmed FY25 revenue ($6.745–6.805B) and 40% non-GAAP operating margin midpoint, and pushed the narrative beyond "AI as tailwind" to agentic AI as a re-architecting of engineering workflows. The Emsys (Ansys) deal still hinges on China SAMR clearance; management says H1 close remains the plan with no Plan B.

Headline numbers

EPS

Q2 FY2025

$3.67

Revenue

Q2 FY2025

$1.60B

+10.3% YoY

Gross margin

Q2 FY2025

80.2%

Operating margin

Q2 FY2025

23.5%

Key financials

Q2 FY2025
MetricQ2 FY2025YoY
Revenue$1.60B+10.3%
EPS$3.67
Gross margin80.2%
Operating margin23.5%

Guidance

Prior quarter data unavailable — comparison not possible.

Segment performance

Q2 FY2025
SegmentQ2 FY2025YoY
Design Automation$1.122B+6.4%
Design IP$0.482B+20.5%

Platform metrics

Q2 FY2025
SegmentQ2 FY2025
Subscription Products Mix (Time-based + Upfront)$1,339.0M (83.5% of total revenue)
Time-based Products Revenue$828.3M
Upfront Products Revenue$510.7M
Maintenance and Service Revenue$265.3M

Profitability

Q2 FY2025
SegmentQ2 FY2025
Design Automation Operating Margin40.9%
Design IP Operating Margin31.2%
Total Adjusted Segment Operating Income$609.3M
Non-GAAP Operating Income$609.3M (37.9% margin)

Management tone

The call reads more assertive and visionary than recent Synopsys cadence — management has stopped describing AI as a tailwind and started positioning Synopsys as the architect of a workflow paradigm shift, while keeping discipline around China and Emsys-deal language.

The framing on AI has moved from optimization tooling to agentic engineering. Management explicitly described a transition where "R&D teams focus on important architecture and design decisions while tasking agent engineer technology with implementation details" — and added that "Synopsys is seizing the opportunity to re-engineer engineering." The signal is that management sees a chance to shift EDA's monetization model from per-seat licensing toward agent orchestration, which would be a structural TAM expansion rather than cyclical growth.

The China commentary turned more direct. Management acknowledged "the tale of two markets persisted in Q2" with AI/HPC robust and China softening, and confirmed in Q&A that China revenue will decline year-over-year in FY25 versus FY24. Analyst Lee Simpson characterized China as roughly 10% of mix (and ~12% in Q1) in framing his question; management did not confirm a specific percentage. The notable point is that the FY guide was reaffirmed anyway — management is signaling enough strength elsewhere to absorb a known regional headwind without flexing the full-year number.

On the pending Emsys (Ansys) acquisition, the language stayed firm but conditional. Phase-one approvals are in across all jurisdictions; SAMR in China remains the lone open approval and is "in active negotiation." Management said there is no Plan B — they are managing only to the completion scenario. The confidence in H1 close, despite SAMR uncertainty that has historically dragged on (analysts referenced the SPI precedent), is the load-bearing assertion for the year's strategic narrative.

On competitive positioning, management used "first mover" and "clear leader" language across emerging interconnect standards — PCIe 7.0, UA-Link, NVLink Fusion — more aggressive than the typical "leading EDA vendor" framing.

Recurring themes management leaned on this quarter:

AI as fundamental industry transformation, not just trendLeadership in agentic AI and multi-physics design solutionsMulti-die/chiplet architecture adoption driving complexity and Synopsys positioningLeading-edge process node enablement (Angstrom era, sub-2nm)High-speed IP and connectivity standards (PCIe 7.0, UA-Link, NVLink)GenAI-powered design acceleration (hours to minutes workflows)

Risks management surfaced:

China market slowdown and SAMR regulatory clearance for Emsys acquisitionNon-AI industrial and automotive market demand remains subduedMacro market fluctuations despite AI/HPC robustnessExecution risk on Emsys integration and regulatory approvalsCompetitive displacement risk in high-bandwidth memory layout flows

Q&A highlights

Lee Simpson · Morgan Stanley

China sales declining to high single-digit percent of mix; question on whether China business carries group average margins and what bottom-line impact potential BIS export control changes could have.

Management confirmed China will decline year-over-year in FY25 vs FY24 but reiterated full-year guidance due to strength in other regions and portfolio. Cannot speculate on margin impact from unconfirmed BIS notices. Clarified bond coupon timing with catch-up payment.

China revenue declining year-over-year FY25 vs FY24China was 10-12% of sales mixFull-year guidance reiterated despite China decline$10 billion bond issuance with first payment October 1, 2024

Gianni Conti · Deutsche Bank

Color on next Intel renewal opportunity/risk given R&D spend concerns; confidence level on ANSYS deal closing in H1 given only China roadblock and potential for prolonged negotiations like SPI.

Opportunities arise when customers push roadmaps and design complex chips; Intel renewal creates opportunity if they invest in new nodes/markets. ANSYS deal confidence based on merits, phase-one approvals across jurisdictions, and active SAMR negotiations. Focused only on completion scenario, not contingency plans.

Intel has multi-year committed agreements for EDA, IP, and hardwareANSYS deal expected to close in H1 FY25Phase-one approvals received across all jurisdictionsCurrently in active negotiation with SAMR (China's Ministry for Industry and Information Technology)

C.T. Panagrahi · Mizuho

Design activity trends outside AI; stabilization signals in industrial/automotive. When will AI/agentic companies building custom chips reach hyperscaler levels of design spending and become significant opportunity?

Non-AI semiconductor market showing pickup in automotive/industrial after prior declines, evidenced first in IP portfolio. Three customer categories: merchant chip buyers, ASIC-model builders, and custom AI system designers. All three represent significant opportunities for EDA, IP, and hardware, particularly verification tools (HAPS 200, Zebu 200) even for ASIC-model builders.

Automotive and industrial markets stabilizing with new energy/vitalityThree customer categories for AI chip design: merchant chip, ASIC-model, and custom systemMulti-die architectures creating design complexity and opportunityHAPS 200 and Zebu 200 hardware tools critical for software-hardware verification

Jay Vlischauer · Griffin Securities

Reference to 'six areas' of engineering workflow change needed; relationship to AI adoption. Distinction between optimization AI (classical EDA) vs. agentic AI and workflow transformation opportunity/risk.

Re-engineering of engineering applies across markets: multi-die systems require thermal/fluid integration; automotive/robotics require multi-physics integration. First AI wave focused on optimization (DSO, VSO, ASO adoption); current agentic phase enables specific task automation (RTL, formal verification) with agent orchestration representing next monetization opportunity. Agents at L2-L3 maturity levels; continuing L2 task-agent development while advancing orchestration.

Six workflow changes addressing electronics + physics (thermal, fluid) integrationDigital twin opportunity for future productsDSO.ai, VSO.ai, ASO.ai showing strong customer traction in optimizationAgent engineer technology at L2-L3 maturity (L1-L5 scale)

Joe Brewink · Baird

Has Synopsys typically had foresight on commerce deliberations; skepticism about lack of advance warning on potential China restrictions. Non-China R&D landscape improvement: is it approaching 2021-2022 strength levels?

No advance notice received from BIS; cannot speculate on why. Non-AI semiconductor showing pickup in automotive/industrial with customers contemplating AI integration into next-gen chips. Customers investing in R&D modification/increases to build sophisticated chips with AI capability for new markets. Not same-chip derivatives but more complex designs.

No notice received from Bureau of Industry and SecurityPickup in automotive, industrial, robotics applicationsCustomers adding AI capability to non-AI chip designsR&D investment modifications/increases expected as customers compete in AI-enabled market

What to watch into next quarter

SAMR clearance for Emsys/Ansys — management committed to H1 FY25 close with no Plan B. Failure to close by the end of Q3 would force a narrative reset; watch for any change in deal-confidence language.

Design IP growth rate — IP grew 20.5% YoY this quarter and is carrying the consolidated growth rate. Watch whether IP holds above ~15% YoY in Q3 as PCIe 7.0 and UA-Link wins convert to revenue.

China revenue magnitude — management confirmed YoY decline in FY25. Watch for explicit dollar-impact disclosure or any BIS notice that would force a guide change.

Design Automation reacceleration — DA grew only 6.4% YoY versus IP's 20.5%. Watch whether agentic AI commentary translates into a measurable DA growth inflection rather than remaining a forward narrative.

FY25 non-GAAP operating margin trajectory — Q2 came in at 37.9% against a 40% FY midpoint target. The back half needs material margin expansion to hit the reaffirmed guide.

Sources

  1. Synopsys Q2 FY2025 press release (Exhibit 99.1), filed with the SEC: https://www.sec.gov/Archives/edgar/data/883241/000119312525129525/d815632dex991.htm
  2. Company-provided Synopsys Q2 FY2025 earnings call transcript (prepared remarks and Q&A), May 28, 2025.

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